Electronic Adhesives

Solution Overview

Rayland Chemical provides high-performance epoxy adhesive solutions for the electronics industry, covering applications such as chip packaging, circuit board bonding, and component mounting. Our products offer superior electrical insulation, heat resistance, and long-term reliability, meeting stringent requirements across consumer electronics, industrial electronics, and automotive electronics sectors.

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Industry Challenges

The miniaturization trend in electronic components is driving increasingly stringent requirements for adhesive precision and reliability.

The high-temperature reflow process requires the adhesive to have excellent heat resistance.

Requires excellent moisture-proof insulation for humid environments.

Automated production requires adhesives with stable rheological properties and curing rates.

Recommended Products

Water-based Epoxy Resin RLC-WEP-100: Low viscosity, high penetrability for potting precision electronic components

Room-Temperature Curing Agent RLC-HC-200: Rapid curing at ambient temperature to boost production efficiency

Latent Catalyst RLC-CT-600: Single-component system with extended pot life and rapid curing upon heating.

Epoxy Toughener RLC-TG-500: Enhances adhesive layer toughness and impact resistance against drops

Solution Advantages

Excellent electrical insulation performance; volume resistivity >10¹⁵ Ω·cm

Excellent high-temperature performance; Tg exceeds 150°C.

Low-stress formulation to reduce thermal stress damage to chips

RoHS compliant and halogen-free

Application Areas

Chip packaging

PCB bonding

Component Fixing

LED Packaging

Sensor potting

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